"Multibeam Unveils First-Ever Multicolumn E-Beam Lithography Chip Technology in the Industry"

In a groundbreaking development for the global semiconductor industry, Multibeam Corp. has unveiled the MB platform, a pioneering Multicolumn E-Beam Lithography (MEBL) system designed to enhance chip manufacturing processes.

This innovative lithography system is crucial for precisely printing patterns onto chips and is tailored for mass production. Its fully automated, precision-patterning technology will support applications such as rapid prototyping, advanced packaging, high-mix production, chip identification, and compound semiconductors.

Multibeam’s founders describe this technology as a blend of the speed of a printing press and the flexibility of a pencil, set to redefine chip design printing. The first system will be delivered to SkyWater Technology, which will utilize it for early concept prototyping and rapid microchip production. David K. Lam, CEO and chairman of Multibeam, and Ken MacWilliams, president of Multibeam in Santa Clara, California, emphasized in a media interview that this order validates Multibeam’s readiness to revolutionize chip fabrication.

Lam, a pioneer in semiconductor manufacturing, indicated that Multibeam’s technology could enhance chip fabrication productivity by 100 times compared to existing systems. He and MacWilliams are committed to extending Moore’s Law, which asserts that the number of components on a chip doubles approximately every two years—a principle that has driven technological advancements since Gordon Moore's prediction in 1965.

The evolution of Moore’s Law, which has drastically reduced chip sizes while increasing performance, has faced challenges as easier methods have plateaued. Consequently, chip makers are now exploring innovations in 3D packaging to attain better performance and faster connections; however, this leads to larger chip designs and the construction of costly chip factories, which can exceed $20 billion.

Multibeam's new platform significantly elevates e-beam lithography (EBL) by incorporating a novel architecture with multiple miniature columns that operate in parallel, resulting in over 100 times the throughput of conventional EBL systems. This advancement positions the MB platform as the highest productivity, maskless lithography system available, empowering manufacturers to rapidly develop and market new integrated circuit (IC) designs.

Developed by a team of semiconductor equipment experts over seven years, the MB platform is the first EBL system engineered specifically for high-volume production and represents a significant advancement within the U.S. lithography sector amid rising geopolitical competition.

Lam expressed excitement about the MB platform's launch and its capacity to foster innovation across various markets, particularly amid the burgeoning fields of AI and edge computing. The MB platform complements existing lithography solutions for integrated circuit leaders, allowing for rapid learning cycles and efficient transitions to production.

As Multibeam transitions from a developmental stage to a high-productivity producer of Multicolumn E-Beam Lithography systems, the MB platform addresses the limitations of traditional EBL while offering a flexible, non-mask-based solution suitable for emerging applications.

MacWilliams noted that this innovation enables significant enhancements in advanced packaging and facilitates new chip-to-chip interconnects that rival on-chip interconnects, cultivating an industry shift towards what is being termed “advanced integration.”

The MB platform is protected by more than 40 patents and is designed for volume production from the ground up. It features an automated wafer loading and alignment process, bolstering productivity and accuracy. The platform's mask-less lithography capabilities allow rapid design iterations, significantly reducing development timelines and costs compared to optical mask development.

Incorporating technology from Synopsys, the platform generates precise write recipes, allowing designers to create intricate patterns directly on wafers, further optimizing design flexibility. Its compact footprint also contributes to lower power requirements and reduced facility space needs, and it is available in configurations of 150mm, 200mm, and 300mm.

With the MB platform, Multibeam is poised to set a new standard in chip manufacturing, ensuring a future where advanced lithography technologies drive continuous innovation in the semiconductor industry.