Xmems Labs has introduced a groundbreaking “fan on a chip” micro-cooling technology aimed at actively cooling smartphones, tablets, and other mobile devices.
These all-silicon components are incredibly compact, measuring just a millimeter thick—similar to the company’s micro speakers produced using Micro Electromechanical Systems (MEMS) technology, where intricate mechanical structures are fabricated from silicon on semiconductor chips. Joseph Jiang, CEO of Xmems, highlighted this innovation in a recent interview.
The Xmems XMC-2400 µCooling chip represents the first active micro-cooling solution tailored for ultramobile devices and next-generation AI applications. Unlike conventional cooling methods, this chip allows manufacturers to integrate silent, vibration-free active cooling directly into their products.
“Our µCooling fan-on-a-chip design addresses a crucial challenge in mobile computing,” said Jiang. “As ultramobile devices increasingly support processor-intensive AI applications, effective thermal management becomes essential. Prior to the XMC-2400, no active cooling solutions were viable due to size constraints.”
Measuring only 9.26 x 7.6 x 1.08 millimeters and weighing less than 150 milligrams, the XMC-2400 is 96% smaller and lighter than traditional active cooling options. It can move up to 39 cubic centimeters of air per second, even under significant back pressure.
This all-silicon solution promises high reliability, part uniformity, and robustness, with an IP58 rating for ingress protection. Engineering samples are expected to be available in Q1 2025, leading to volume production and shipments to customers shortly thereafter.
Xmems µCooling employs the same fabrication process as its award-winning Xmems Cypress micro speaker technology, which is set for production in Q2 2025, with strong customer commitments. Jiang noted, “Having successfully introduced MEMS micro speakers, we are now redefining perceptions of thermal management. The XMC-2400 can actively cool even the most compact handheld devices, paving the way for ultra-thin, high-performance, AI-ready mobile technology.”
Demonstrations of the XMC-2400 will commence in September during the Xmems Live events in Shenzhen and Taipei.
Founded in January 2018, Xmems Labs holds over 150 patents for its platform technologies and operates as a fabless chip firm, with its chips manufactured by contract makers. Based in Santa Clara, California, the company has raised approximately $75 million and employs 70 personnel.
How It Works
The XMC-2400, weighing less than 150 milligrams, uses piezoMEMS technology, which mimics small air pumps in silicon to generate airflow effectively. By applying voltage, MEMS structures inside the chip can be actuated to produce sound or, in this case, cooling air.
“This device allows designers flexibility in air movement, with options to push, pull, or cool,” Jiang explained. Additionally, it operates in the ultrasonic range, making it silent and allowing it to be placed away from a CPU, unlike traditional fans which are typically larger and louder.
Potential customers will determine how many fans and chips to incorporate into their final products, with Jiang stating, “Collaboration with early alpha customers will guide our deployment strategy.”
With millions of units capacity per month and multiple chip manufacturers in the supply chain, Xmems ensures a reliable production process. The XMC-2400 aligns with the trend of moving from mechanical to silicon devices, enhancing reliability and performance in consumer electronics.
As mobile devices continue to integrate advanced technologies like AI, thermal management remains a significant concern. Jiang emphasizes the need for innovative cooling solutions, asserting, “Current smartphones struggle with heat management, particularly when utilizing demanding applications like gaming.”
In summary, the Xmems XMC-2400 µCooling chip not only represents a significant leap in mobile thermal management but also sets the stage for the next generation of ultra-compact, high-performance mobile devices.
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