Samsung Launches Mass Production of Memory Chips for On-Device AI Applications

In response to the increasing demand for on-device AI, Samsung Electronics has initiated mass production of the industry's thinnest low-power dynamic random access memory (DRAM) chips.

Samsung is now manufacturing 12-nanometer (nm) class, 12-gigabyte (GB) and 16GB LPDDR5X DRAM packages. These ultra-slim devices, comparable in thickness to a fingernail, exemplify how AI is influencing the evolution of electronics.

By leveraging its advanced chip packaging expertise, Samsung delivers LPDDR5X DRAM packages that create additional space within mobile devices, enhancing airflow and facilitating better thermal management. This is particularly crucial for high-performance applications that incorporate on-device AI.

"Samsung’s LPDDR5X DRAM sets a new standard for high-performance on-device AI solutions, offering not only superior LPDDR performance but also advanced thermal management in an ultra-compact package,” stated YongCheol Bae, EVP of memory product planning at Samsung Electronics. “We are committed to continuous innovation through close collaboration with our customers, delivering solutions that meet future demands in the low-power DRAM market."

The new LPDDR5X DRAM packages represent the industry's thinnest 12 nm-class LPDDR DRAM in a 4-stack structure, achieving a thickness reduction of approximately 9% and enhancing heat resistance by about 21.2% compared to previous generations.

Samsung's new LPDDR5X memory chips measure just 0.65 millimeters (mm) in thickness, making them the slimmest available for 12GB or larger capacities. Innovations in printed circuit board (PCB) design and epoxy molding compound (EMC) techniques contribute to this remarkable form factor. Additionally, Samsung's optimized back-lapping process minimizes package height, ensuring a streamlined profile.

Looking forward, Samsung aims to expand its low-power DRAM market by supplying the 0.65mm LPDDR5X DRAM to mobile processor makers and device manufacturers. As the demand for high-performance, high-density mobile memory solutions in smaller package sizes rises, the company plans to develop 6-layer 24GB and 8-layer 32GB modules, further pushing the boundaries of LPDDR DRAM miniaturization for future devices.