Apple is collaborating with Broadcom to create its first dedicated AI server chip, which is expected to be in production by 2026. The chip, named Baltra, is designed to meet the growing computational needs of Apple's expanding AI capabilities, while improving performance and energy efficiency.
This collaboration represents a significant advancement from their 2023 agreement, where Broadcom started developing 5G radio frequency components for Apple's devices. For the new AI chip, Apple's silicon design team in Israel will lead the development, with manufacturing being done by Taiwan Semiconductor Manufacturing Company (TSMC).
The demand for this specialized hardware arises from the increasing complexity of AI tasks that Apple aims to manage. While some AI functions can be processed directly on devices like iPhones, iPads, and Macs, more intensive operations, such as text summarization and writing tools, require powerful cloud-based servers. By developing its own AI-optimized server infrastructure, Apple can reduce its dependence on external providers like Google Cloud and Amazon Web Services, which currently support its search and Apple Intelligence programs.
Creating these chips in-house aligns with Apple's strategy to maintain strict control over its technology and speed up advancements in AI. This move not only strengthens Apple's independence but also places the company in a better position to compete effectively in the fast-evolving AI landscape.
Although Apple and Broadcom have not officially commented on the collaboration, the news has been positively received by the market, despite some initial fluctuations in stock prices. The partnership underscores Apple's dedication to investing in advanced AI technology and building robust, efficient computing platforms to fuel its future innovations.