Haowe SBC OKX0210: The First Domestic Product to Achieve C&S CAN SIC Certification!

Introducing the OKX0210: A Cutting-Edge In-Vehicle Mini SBC

Recently, Howey Group launched its advanced in-vehicle mini System-on-Chip (SoC), the OKX0210, which incorporates a high-speed CAN transceiver along with automotive-grade CAN SIC (Signal Improvement Capability). The OKX0210 has successfully passed the CAN SIC interoperability compliance certification from the renowned C&S Laboratory in Germany, making it the first SBC product in the country to achieve this certification.

The C&S Laboratory, part of the Communication & System Group in Germany, has decades of expertise in developing and testing automotive network communications. Their certification is held in high regard across the industry, recognized by numerous automakers, Tier 1 suppliers, and simulation tool developers.

CAN bus technology is widely utilized for communication between various automotive modules due to its stability and scalability. In networks featuring dozens of CAN communication nodes, transceivers often come from multiple semiconductor manufacturers. Therefore, it is essential to ensure that these nodes can work together seamlessly within the same topology, which necessitates a uniform C&S compatibility certification for all CAN transceivers. This certification not only requires compliance with ISO11898 and ISO16845 standards but also involves passing approximately 190,000 interoperability tests by C&S, which cover areas like fault injection, state switching, ground offset, and token communication.

As the first basic chip in the country to pass C&S CAN SIC compatibility testing, the OKX0210 facilitates unobstructed communication with upstream and downstream devices on the vehicle's CAN bus. It effectively connects with other CAN transceivers certified by C&S. Moreover, the SIC feature of the OKX0210 ensures its capability to handle complex topologies with communication speeds exceeding 5 Mbps.

The foundational chip is currently in the sample testing phase and is expected to enter mass production by the third quarter of 2024, making it a highly recommended choice for integration in automotive applications.